This document is written to capture the results of the first part of the assembly process. There is a brief explanation as to why we chose to have only a portion of the assembly done using an outside assembly house. Then we present an evaluation of the BGA and LGA component connections made using x-ray equipment belonging to the Computing Division.
Files in Document:
PDF File (Assembly and Inspection of the Booster LLRF DDS Module...pdf, 2.7 MB)